RS-HYRZN4801HEC-3 Label
RS-HYRZN4801HEC-3 Label
Mode
RS-HYRZN4801HEC-3
Product Form Label
Chip Alien Higgs EC
Label Size 73 × 18 mm
Antenna Size 70 × 15 mm
Frequency 860 ~ 960 MHz
EPC / User / TID Memory 128 / 128 / 48 bits
Capacity 100M/Daily
MOQ 1,000 PCS
  • RS-HYRZN4801HEC Label Datasheet.pdf RS-HYRZN4801HEC Label Datasheet.pdf
  • Product Description
  • Why Choose us
Item Description
Mode
RS-HYRZN4801HEC-3
Chip
Alien Higgs EC
Frequency
UHF(860 ~ 960 MHz)
Standard
EPC Class 1 Gen 2; ISO/IEC 18000-6C
Label size
73 × 18 mm
Antenna size
70 × 15 mm
Label pitch
22.225 mm
Release paper width
80 mm
Application Liquid Packaging Management, Supply Chain, Logistics Management
Label Dimension
Roll Out Diagram
Layer Structure
Manufacture Process
Company Profile
HY-Link is a professional RFID inlay and label manufacturer since 2003, with current capacity 3Millions daily and reach 6Billions annually in plan.

The world class facility equipped top brands’ machines from Muehlbauer flip-chip bonding & converting.
As a RAIN member, HY-Link aims the top player of independent inlay assembly hourse serving global market. Constant investment will benefit all partners reliable growth.

Located in Jingjiang China with 2 hours’ drive to Shanghai. With a rich experienced semi-conduction management team over 100 employees.

Attractive price, Super-fast shipping, Professional service and strategic partnership makes multi-wins!
Certificate
Manufacture




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