CD/DVD Tag
CD/DVD Tag
Chip NTAG215
Antenna Size φ21 mm
Frequency 13.56 MHz
Protocol
ISO 14443A
User Memory
2528 Bits
MOQ 1,000 PCS
  • Product Description
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Item
Description
RFID Inlay
Size (Final Cut-out)

OD 116 mm, ID 41 mm

Thickness (Over IC)
~ 380 μm
Thickness (Over Antenna)
~ 260 μm
RFID Chip
IC Code
NXP ICODE SLIX2 SL2S2602
RF Protocol
ISO 15693
Thickness
~ 120 μm
EEPROM Memory Size
2560 bits
User Memory Size
2528 bits
Antenna Substrate
Antenna Size
Ø110 mm
Material
Alu etched on PET substrate
Cross over connection
Crimping process
Protective Tape
PET Clear
PSA of Protective Tape
Acrylic
Liner
Release paper

Reliability

  • Operating Temperature:-20°C ~ 70°C (-4°F ~ 158°F), at <60%RH(according to and limited by chip specification)

  • Storage Life: 2 years under desiccated condition; 10°C ~ 25°C (50°F ~ 77°F), ≤ 60% RH

  • Thermal Cycle Test: 100 cycles under -55°C/85°C (-67°F/185°F) 15mins dwell; Thermal Humidity Test: 168 hours under 85°C(185°F)/85%RH

Dimension of RFID Wet inlay in Reel Format



Item Description
Dimension
Tolerance
P
Pitch of Wet Inlay to Wet Inlay
125 mm
± 1.5 mm
W Liner width
125 mm
± 2.0 mm
ID Wet Inlay Inner Diameter Die-cut size
Ø 41 mm
± 0.5 mm
OD Wet Inlay Outer Diameter Die-cut size
Ø 116 mm
± 0.5 mm
CD Transponder antenna Outer size
Ø 110 mm
± 0.5 mm
A Transponder die-cut Wet Inlay to web edge
4.5 mm
± 1.5 mm
Miscellaneous
Thickness of the IC
120 um
± 10%
Overall thickness of transponder package
(excluding IC and Liner)
260 um
± 10%
Thickness of Liner
120 um
± 10%



Packing Information
Structure
Manufacture Process



As a RAIN RFID member, HY-Link is a large-scale RFID transponder maker since 2003 for various UHF, HF/NFC inlay assembly. Now with current daily capacity 3Million dry inlays and 1.5Billion annual plan during 2023-2024.


We have worldclass facility equipped those top brands’ manufacturing machines like Muehlbauer flipchip bonders TAL15K/DDA40K , converting machines, and testing machines etc.



Located in Jingjiang city with 2 hours’ drive to Shanghai, with a rich-experienced team over 100 employees. We are now serving many OEM,ODM outsourcing customers for dry inlay, wet inlay and label.


Embracing future wave of passive wireless IoT, we support “RFID+” multi-component assembly technologies for RFID LED tag, RFID+ sensor, capacitor and protection epoxy etc.


Competitive price, quick delivery,and professional service


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